Purpose	A fast-speed maskless alignment photolithography tool that patterns feature size down to 2um; UV LED direct-write system for feature sizes at the micron level
Location	Photo-Lithography Bay, RPF Cleanroom
Material systems	Photoresist coated substrates with up to 6mm thickness
Scale / volume	365nm LED wavelength, fast writing speed; accommodates up to 6 inch wafers
Specs / resolution	2um; maximum write area is 125mm x125mm
	* Not an ANFF-supported tool; access is available – refer to Access Fees schedule